End-to-End
Semiconductor
Solutions
From design and component sourcing to manufacturing support, SAKTECH helps companies build reliable next-generation electronic products.
ABOUT US
Silicon to scale — designed for production
SAKTECH GROUP brings together semiconductor, product design, and manufacturing expertise to turn complex chip programs into production-ready silicon.
SAKTECH GROUP was founded by semiconductor veterans with 25+ years in fabs, foundries, and ASIC programs, supported by experts in DFM/DFT, verification, EMS, and global supply chains. Together, we turn complex requirements into reliable, manufacturable products—on schedule and on budget.
We support the full journey: architecture, PDK and node selection, analog/RF & mixed-signal design, physical design & sign-off, packaging, test, and EMS ramp. Whether you’re targeting 2-inch analog or 300 mm production, we optimize die area, DPW, yield, and total landed cost to hit your business goals.
Why Leading Teams Choose SAKTECH
From architecture to volume ramp, we help teams reduce risk, improve yield, and accelerate production readiness.
Deep Industry Expertise
30+ years of semiconductor leadership with hands-on experience in product design, ASIC programs, and EMS execution.
End-to-End Execution
From specification → silicon → package → test → volume production.
Yield & Cost Optimization
DPW modeling, DFM strategy, and supply-chain alignment to reduce total cost.
Faster Tapeout, Fewer Surprises
Structured workflows, proven checklists, and reliable execution.
Let’s build your next chip — faster and with confidence.
From feasibility and cost modeling to tapeout and volume ramp, SAKTECH is your partner for high-quality, production-ready silicon.
Our Products
We build and scale the electronics you rely on. From rapid IoT prototyping to volume manufacturing and custom silicon, SAKTech delivers reliable, production-ready solutions.
IoT Modules
Compact, certified modules for fast integration—Wi-Fi, BLE, LTE/5G, LoRaWAN, GNSS, and sensor hubs with secure OTA, low power, and reference firmware.
EMS (Electronics Manufacturing Services)
DFM/DFA, sourcing, SMT/THD, box build, ICT/FPY test, and global logistics. NPI to mass production with strict quality systems and full traceability.
Semiconductor (ASIC & Packaging)
Architecture to tapeout: analog/RF & mixed-signal, physical design & sign-off, packaging, test, and yield optimization to minimize die cost and time-to-market.